The traditional ultrasonic cleaning machine can only clean the ordinary stains on the surface of the sapphire wafer, and it is difficult to remove some stubborn stains or marks with strong adhesion due to grinding processing. Aiming at the characteristics of high hardness, thin wafer and small size of sapphire wafer, this paper discusses the design of automatic sapphire wafer cleaning machine based on MCD. Through the analysis of the functional requirements of the equipment, the method of direct cleaning with nylon brush is adopted, and the process flow of automatic control is designed to determine the working rhythm and time allocation. The overall structure is divided into five core components for modular design: forward component, rotation, cleaning, spray and pneumatic door. The forward component will transport the wafer into the cleaning area, the rotating component will ensure uniform force on the wafer during cleaning, the cleaning component will deeply clean the wafer surface through a brush, the spray assembly uses high-pressure water flow to help clean residual stains, and the pneumatic door assembly controls the air flow to ensure a stable cleaning environment. According to the requirements of full automation of equipment control, Siemens S7-1500 PLC is selected for PLC programming and HMI touch screen design of wafer cleaning machine, and the simulation bridge between NX and PLC is established through MCD function to carry out accurate one-to-one corresponding signal mapping to realize the joint adjustment of mechanical parts, sensors, drivers and motion. The virtual electric mechanical joint debugging of automatic chip cleaning machine based on MCD ensures the feasibility and reliability of automatic chip cleaning machine products, and improves the design efficiency and market competitiveness of products.

An Fang, Zhang Ningju, Huo Yongchao, Ou Juanhua. Module design and virtual debugging of automatic chip cleaning machine based on MCD. International Journal of Frontiers in Engineering Technology (2024), Vol. 6, Issue 5: 1-7. https://doi.org/10.25236/IJFET.2024.060501.

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