In response to the new demands for lead-free solder deposit preparation technology brought about by the miniaturization and high-density integration of electronic components, this study, based on a self-developed methanesulfonate-based barrel plating solution, systematically investigated the effects of key barrel plating process parameters-including current density, plating solution temperature, pH value, barrel rotation speed, and plating time-on the composition of Sn-Ag-Cu deposits. The results indicate that current density and temperature are the predominant factors influencing deposit composition, while pH value and rotation speed exhibit a comparatively negligible impact. Prolonged plating time leads to a slight decrease in the Ag and Cu content within the deposit due to concentration depletion. Through the optimized barrel plating process, a uniform alloy deposit with a composition close to the eutectic composition of Sn-3.0Ag-0.5Cu was successfully achieved on 1mm copper spheres.

Xianming Lv, Shaojun Li, Ningbo Li, Xi He, Xiaoliang Li, Lei Zhang, Hailin Jiang, Zhan Cheng. The Influence of Barrel Plating Process Parameters on the Composition of Sn-Ag-Cu Deposits. Academic Journal of Materials & Chemistry (2025), Vol. 6, Issue 3: 85-90. https://doi.org/10.25236/AJMC.2025.060312.

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