Welcome to Francis Academic Press

Academic Journal of Computing & Information Science, 2021, 4(7); doi: 10.25236/AJCIS.2021.040713.

Simulation and Optimization of High Performance 3D Vertical Spiral Inductor

Author(s)

Haoran Wang1, Tao Zhang1, Chongmei Peng1,2, Zhaohui Chen3

Corresponding Author:
Zhaohui Chen
Affiliation(s)

1Institute of Microelectronics, Chinese Academy of Sciences University of Chinese, Academy of Sciences Beijing, China

2High-Frequency High-Voltage Device and Integrated Circuits Center Institute of Microelectronics, Chinese Academy of Sciences Beijing, China

3Shanghai Integrated Circuit Materials Research Institute Co., Ltd Shanghai, China

Abstract

In this paper, three inductor structures with different magnetic cores are established to explore the influence of magnetic core shape on inductor performance, based on the three-dimensional vertical spiral inductor. Through three-dimensional electromagnetic simulation, it is found that the introduction of the central magnetic column and the up and low magnetic leakage prevention plates greatly increases the inductance L and the quality factor Q of three-dimensional vertical spiral inductor by increasing the permeability of magnetic core and reducing the leakage loss. Based on this conclusion, a dumbbell-shaped magnetic core structure with the characteristics of central magnetic column and up and low magnetic leakage prevention plates is proposed. The three-dimensional electromagnetic simulation results verifies the excellent performance of inductor with dumbbell-shaped magnetic core which maximum quality factor is increased from 34 to 76, and the inductance value at the corresponding frequency is increased from 6nH to 64nH. It can be found that adding special magnetic cores is an effective way to improve the performance of three-dimensional integrated inductors, which provides a direction for the research on improvement of three-dimensional integrated inductor performance.

Keywords

MEMS, inductor, three-dimensional vertical spiral, dumbbell-shaped core, quality factor, magnetic core

Cite This Paper

Haoran Wang, Tao Zhang, Chongmei Peng, Zhaohui Chen. Simulation and Optimization of High Performance 3D Vertical Spiral Inductor. Academic Journal of Computing & Information Science (2021), Vol. 4, Issue 7: 88-95. https://doi.org/10.25236/AJCIS.2021.040713.

References

[1] H. K. Krishnamurthy et al., "A Digitally Controlled Fully Integrated Voltage Regulator With 3-D-TSV-Based On-Die Solenoid Inductor With a Planar Magnetic Core for 3-D-Stacked Die Applications in 14-nm Tri-Gate CMOS," IEEE Journal of Solid-State Circuits, 2018.

[2] C. C. Tang, C. H. Wu, and S. I. Liu, "Miniature 3-D inductors in standard CMOS process," IEEE Journal of Solid-State Circuits, vol. 37, no. 4, pp. 471-480, 2002.

[3] S. L. Selvaraj, M. Haug, C. S. Cheng, D. Dinulovic, and M. Wieland, "On-Chip Thin Film Inductor for High Frequency DC-DC Power Conversion Applications," in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), 2020.

[4] S. Seok, C. Nam, W. Choi, and K. Chnm, "A High Performance Solenoid-Type MEMS Inductor," J.semicond.tech, vol. 1, no. 3, 2001.

[5] J. B. Yoon, Y. S. Choi, B. I. Kim, Y. Eo, and E. Yoon, "CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs," Electron Device Letters IEEE, vol. 23, no. 10, pp. 591-593, 2002.

[6] Kyuchul et al., "High-performance inductors integrated on porous silicon," Electron Device Letters IEEE, 2005.

[7] J. W. Lin, C. C. Chen, and Y. T. Cheng, "A robust high-Q micromachined RF inductor for RFIC applications," IEEE Transactions on Electron Devices, vol. 52, no. 7, pp. 1489-1496, 2005.

[8] Y. J. Kim and M. G. Allen, "Surface micromachined solenoid inductors for high frequency applications," Components Packaging & Manufacturing Technology Part C IEEE Transactions on, vol. 21, no. 1, pp. 26-33, 1998.

[9] D. S. Gardner, G. Schrom, P. Hazucha, F. Paillet, T. Karnik, and S. Borkar, "Integrated On-Chip Inductors with Magnetic Films," IEEE Transactions on Magnetics, vol. 43, no. 6, pp. 2615-2617, 2007.

[10] "Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films," IEEE Transactions on Magnetics, vol. 49, no. 7, pp. 4176-4179, 2013.

[11] A. Yh, A. Zz, R. A, G. B. Wei, A. Hz, and A. Fb, "On-chip coupled inductors with a novel spliced anisotropic and isotropic magnetic core for inductance and coupling enhancement - ScienceDirect," Solid-State Electronics, vol. 164.

[12] Y. G. Ma and C. K. Ong, "Soft magnetic properties and high frequency permeability in [CoAlO/oxide] multilayer films," Journal of Physics D Applied Physics, vol. 40, no. 40, p. 3286, 2007.