Queen Mary University of London Engineering School, Northwestern Polytechnical University, Xi’an, Shaanxi, 710129, China
Electronics are widely used in everyday life, and in the production of electronic products various electronic components need to be soldered to printed circuit boards. With the miniaturization of electronic components, traditional soldering methods cannot be completed. Reflow soldering technology can be used to complete the printing of tiny electronic components, and in this process, it is critical to the quality of the product to maintain the proper process temperature for each part of the reflow soldering. In this paper, how to achieve temperature control in this process is studied and solved by establishing a mathematical model about differential equations. First, by analyzing the heat transfer of air in the reflow oven, it is found that the air in the oven satisfies the heat transfer equation. Secondly, the temperature of the small temperature zone in the base data is used to obtain the temperature distribution in the furnace at steady state. Again, the temperature of the temperature zone and the speed of the conveyor belt are determined so as to achieve the minimum target area. By constructing the model of genetic algorithm, the area minimization is used as the fitness function. Finally, in this paper, we make the images on both sides from 217°C to the peak temperature as symmetrical as possible. For this problem, we can still build the fitness function by genetic algorithm to solve it.
Furnace temperature profile; finite difference method; heat conduction equation; fixed-step search method; genetic algorithm
Yingchao Hai. Research on Furnace Temperature Curve Control Based on Genetic Algorithm. International Journal of New Developments in Engineering and Society (2022) Vol.6, Issue 2: 63-68. https://doi.org/10.25236/IJNDES.2022.060211.
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