Welcome to Francis Academic Press

International Journal of Frontiers in Engineering Technology, 2022, 4(5); doi: 10.25236/IJFET.2022.040513.

Research on RF Voltage Measurement Method of Chip Pins


Ming Ju, Junshuo Huang, Zhibo Zhu

Corresponding Author:
Ming Ju

Jiangsu Engineering Key Lab of Electrical Equipment and Electromagnetic Compatibility, Nanjing Normal University, Nanjing 210042, China


As the core device of electronic equipment, integrated circuit (IC) usually produces large high-frequency electromagnetic interference. In order to study the generation mechanism and suppression methods of such noise, accurate noise measurement and extraction must be carried out. At present, the measurement standard of chip level electromagnetic compatibility is not perfect, and the high-frequency characteristics of pin noise are difficult to be measured accurately. In order to achieve accurate chip pin RF voltage measurement, this paper designs a chip pin RF voltage measurement method, establishes the 3D model of the chip pin RF voltage measurement module, studies the effects of its wiring, via, substrate dielectric constant and other parameters on its high-frequency signal transmission performance, and then optimizes the module. Simulation and experimental results show that the optimization method effectively improves its high-frequency signal transmission characteristics. Finally, the RF voltage of the output pin of the active crystal oscillator is extracted by using the detection system designed in this paper.


Electromagnetic compatibility, RF voltage, Impedance matching network, Insertion loss

Cite This Paper

Ming Ju, Junshuo Huang, Zhibo Zhu. Research on RF Voltage Measurement Method of Chip Pins . International Journal of Frontiers in Engineering Technology (2022), Vol. 4, Issue 5: 78-85. https://doi.org/10.25236/IJFET.2022.040513.


[1] Pan Xiaodong, Wei Guanghui, Wan Haojian. Research on electromagnetic radiation sensitivity test of electronic equipment[J]. Intense laser and particle beam, 2020, 32(07): 78-84.

[2] D. Murphy et al. A Low Phase Noise, Wideband and Compact CMOS PLL for Use in a Heterodyne 802.15.3c Transceiver[J]. IEEE Journal of Solid-State Circuits, 2011, 46(7): 1606-1617.

[3] Dipesh Kapoor, Cher Ming Tan and Vivek Sangwan. Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits[J]. Applied Sciences, 2020, 10(3).

[4] IC EMC testing and certification technology helps accelerate the development of domestic chips[J]. Safety and electromagnetic compatibility, 2019(04): 115.

[5] Ding Zhizhao, Shan Meilin, Wang Panwei. Security design and implementation of power amplifier chip test system[J]. Shanghai metrology and testing, 2019, 46(05): 2-5.

[6] Zhou Zhi, Qu Shengyuan. Overview of EMC test methods[J]. Digital technology and Application, 2016(02): 227-228.

[7] He Yi . Circuit design of anti electromagnetic interference current mirror[J]. Journal of Shandong Agricultural University, 2020, 51(02): 303-306.

[8] Liu Yaodong, Sun ran, Jiang Wenchao, et al. Overview of EMC Technology in power chip design in China[J]. Journal of Nanjing Normal University (Engineering Technology Edition), 2019, 19(04): 1-7.

[9] Wang Wenjie, Bai yun, Peng Jun, et al. IEC 61967 series - Analysis of radiated emission test methods for integrated circuits[J]. Integrated circuits in China, 2021, 30(05): 69-73.

[10] Luo Jiadi. Research on electromagnetic compatibility between system level packaging and PCB board level[D]. Xi'an University of Electronic Science and technology, 2019.

[11] IEC 61967-4: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions — Magnetic probe method, International Electro Technical Commission[S], 2004.